Applications

The Picolaser workstation is based on a high energy UV picosecond laser (with pulse width about 3-5 ps, pulse energy up to 1 mJ and variable wavelengths up to 213 nm).  Most important applications for our station are listed below:

•     Drilling of tiny holes through thick material (for example, 0.25 mm holes through 3-mm tungsten)
•     Precise cutting of features and milling in thick materials, like stainless steel, ceramics, glass, polymers, PCB, organic capsules, micro- and nano-structured plates. Cost effective replacement of electrical discharge machining.
•     Slicing and dicing of crystals with thickness up to 3 mm and micron precision.
•     Photo-mask repair and ablation lithography.
•     Thin-film deposition.
•     Imaging in fine machining with a sub-micron features, in particular marking and selected surface cleaning.
•     LED cutting and slicing, flat panel and liquid crystal display processing.
•     Transparent materiel modification, high density 3D storage, hologram recording.
•     Laser induced fluorescence and two photon ionization, single and two photon LIBS, time resolved laser, Raman and CARS spectroscopy.
•     Basic research (white light excitation, Optical Parametrical Amplification with 213 nm pumping, high harmonics  generation, free electron laser seeding, combustion studies, two photon polymerization).